Flip chip bonder pertaining to the back-end packaging of semiconductor eliminates the wire bonding process by flipping and placing the chip to the substrate and applying high pressure and heat to soldering the chip directly. The stage used for chip pick and place requires not only high speed but also has good pressure controllability. The proposed stage employs a voice coil motor to do force control and a linear motor to feed through. A special decoupling mechanism is used to decouple the motions of Z and Y axis so that the weight of Z-axis voice coil motor will not be carried by X-axis linear motor to achieve high speed motion and pressure control simultaneously.
| ITEM | X axis (up) | Yaxis(down) | Z axis | |
| Stroke | Effective (mm) | 150 | 50 | |
| Maximal (mm) | 160 | 58 | ||
| Resolution (um) | 1 | 1 | ||
| Straightness (um) | <2 | <2 | ||
| Flatness (um) | <5 | <5 | ||
| XYZ squareness (um) | <5 | |||
| Repeatability (um) | +/- 2 | +/- 2 | ||
| Accuracy (um)
(with laser calibration) |
< 1 | < 1 | ||
| Maximal speed (m/sec) | 4 | 4 | ||
| Maximal Acc. (G) | 7 | 7 | ||
- Y and Z axes are decoupled to move so that the payload for both axes are the same to achieve the same bandwidth.
- Moving magnet is employed so that there is no moving cable for this system.
- The stage employees a bottom base made of cast iron to absorb vibration.
- Ultra-low cogging force linear motors are employed.