Advanced packaging of semiconductor has been the trend to increase the number of transistors per unit area. Either stack a chip on the wafer or directly bond two wafers together, this requires a stage which can perform pitch and roll adjustment. In addition, this stage should be equipped with the force feedback mechanism to ensure the bonding quality. This Z-Pitch-Roll positioning module is developed for this application.
| ITEM | Z axis | |
| Stroke | Effective (mm) | 25 |
| Maximal (mm) | 20 | |
| Resolution (um) | 0.02 | |
| Straightness (um) | <1 | |
| Flatness (um) | <2 | |
| Repeatability (um) | +/- 0.2 | |
| Accuracy (um)
(with laser calibration) |
< 2 | |
| Maximal speed (m/sec) | 0.3 | |
| Maximal Acc. (G) | 2 | |
- Z-pitch-roll 3DOF motion is realized with 3 Z axis together with 3 universal bearing.
- Each axis equipped with load cell for real-time force feedback to equalize the pressure of the whole surface.
- Extremely low cogging linear motor is used to minimize speed ripple.